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Advanced Packaging
Control the surfaces that make 3D integration possible.
Hybrid bonding enables high-density 3D integration by directly joining dielectric surfaces and embedded metal contacts. This supports finer-pitch interconnects and improves thermal performance.
Cu Damascene
Pads etched into dielectric and overfilled with Cu.
CMP
Overburden removed; Cu pads dish below the dielectric.
Plasma Activation
Surfaces activated and hydrated for bonding.
Alignment
Top die flipped and aligned to the bottom die.
Room Temperature Bond
Dielectric bonds, dished pads leave small gaps.
Anneal
Cu expands to close gaps and forms Cu-Cu bonds.
Successful bonding requires control of parameters that only AFM can provide:
Sub-angstrom Cu recess/protrusion and dielectric topography
Nanoscale roughness and local non-uniformity
Wafer/die flatness and deformation
CMP process variation across relevant length scales
The Metron3D is the only system available that combines rich, high-speed, true 3D surface measurement and manufacturing throughputs.
Relative pad height (nm)
Dielectric roughness (nm)
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