Our Technology

Rapid Probe Microscope™

proprietary technology

Rapid Probe Microscope™ (RPM) combines the accuracy and precision of Atomic Force Microscopy with production-ready throughput through a hybrid-optical system of high-speed optical probe actuation and precision interferometry.

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The measurement gap

Traditional metrology has reached its limits.

Traditional metrology has reached its limits.

As semiconductor devices continue to shrink and become increasingly complex, manufacturers require richer three-dimensional surface information without sacrificing throughput or damaging the wafer. Atomic force microscopy (AFM) is the only non-destructive technique that provides local 3D metrology.

Probe tip.
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Atomic Force Microscopy (AFM)

The fundamental trade-off.

The fundamental trade-off.

Traditional AFM is an excellent reference technique for local nanoscale topography. It uses an ultra-sharp tip on a flexible cantilever to scan a surface, measuring the forces between tip and sample to build a precise 3D map of its topography.

Imaging speed is limited by the bandwidth of the piezo which actuates the AFM tip to track the surface topography. Its throughput, field of view and probe-related variability limit cost-effective deployment in high-volume semiconductor manufacturing.

Traditional AFM is an excellent reference technique for local nanoscale topography. It uses an ultra-sharp tip on a flexible cantilever to scan a surface, measuring the forces between tip and sample to build a precise 3D map of its topography.

Imaging speed is limited by the bandwidth of the piezo which actuates the AFM tip to track the surface topography. Its throughput, field of view and probe-related variability limit cost-effective deployment in high-volume semiconductor manufacturing.

Meet RPM

Rapid Probe Microscope™

Hybrid Optical-AFM Architecture

Combining complementary technologies to achieve precision and throughput.

Photothermal Actuation

Enabling exceptionally high bandwidth probe control.

Precision 3-Axis Interferometry

Maintaining angstrom-scale positioning accuracy.

Full Probe Control

Allowing advanced imaging modes and richer surface measurement.

IR Laser

Bends the cantilever directly, instead of waiting on a slow piezo.

Direct Interferometer Height Measurement

Keeps accuracy at speed.

Technology that delivers manufacturing advantage.

Probe tip.

Angstrom-scale precision

Angstrom-scale precision and true 3D measurement provide the insight needed to control increasingly complex manufacturing processes.

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Production-ready throughput

Reveal the process details conventional metrology cannot see, enabling faster learning and deeper manufacturing understanding.

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Process insight

Production-speed measurement turns richer process data into actionable insight, helping manufacturers identify variation and respond sooner.

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Lower cost per wafer

Better process control translates into higher yield, lower cost per wafer and faster time to market.

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