Our Technology
Rapid Probe Microscope™
proprietary technology
Rapid Probe Microscope™ (RPM) combines the accuracy and precision of Atomic Force Microscopy with production-ready throughput through a hybrid-optical system of high-speed optical probe actuation and precision interferometry.

The measurement gap
As semiconductor devices continue to shrink and become increasingly complex, manufacturers require richer three-dimensional surface information without sacrificing throughput or damaging the wafer. Atomic force microscopy (AFM) is the only non-destructive technique that provides local 3D metrology.


Atomic Force Microscopy (AFM)
Meet RPM
Rapid Probe Microscope™
Hybrid Optical-AFM Architecture
Combining complementary technologies to achieve precision and throughput.
Photothermal Actuation
Enabling exceptionally high bandwidth probe control.
Precision 3-Axis Interferometry
Maintaining angstrom-scale positioning accuracy.
Full Probe Control
Allowing advanced imaging modes and richer surface measurement.
IR Laser
Bends the cantilever directly, instead of waiting on a slow piezo.
Direct Interferometer Height Measurement
Keeps accuracy at speed.
Technology that delivers manufacturing advantage.

Angstrom-scale precision
Angstrom-scale precision and true 3D measurement provide the insight needed to control increasingly complex manufacturing processes.

Production-ready throughput
Reveal the process details conventional metrology cannot see, enabling faster learning and deeper manufacturing understanding.

Process insight
Production-speed measurement turns richer process data into actionable insight, helping manufacturers identify variation and respond sooner.

Lower cost per wafer
Better process control translates into higher yield, lower cost per wafer and faster time to market.



