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Manufacturing advantage
Combines angstrom-scale precision with production-ready throughput, delivering unique 3-dimensional process insight that enables tighter process control, improved yield and lower cost per wafer.
Purpose-built for advanced process control.
Hybrid Bonding
Cu pad recess, dishing, and erosion, measured densely enough to characterise readiness for bonding at 60 WPH.
EUV Resist
CDs, profiles and line-edge and line-width roughness at a pixel rate useful for in-line lithography SPC.
Post-CMP
Global and within-die planarity ahead of EUV exposure, where depth-of-focus budgets leave no room for topography surprises.
After Etch
Profile and sidewall angle traced in true 3D instead of inferred from a top-down height map.
Four numbers that change the paradigm
Every AFM measurement moves through the same sequence: Sense the surface, minimize interaction forces, know where you are, reconstruct what you found. Infinitesima reengineered the entire sequence to unlock the true potential of AFM.
10-100x
Higher throughput than conventional AFM
HVM Compatible
<50pN
Peak-tip sample interaction force
Zero Damage Measurement
<50pm
3-sigma repeatability
Exceptional Precision
1,000+
Wafers per probe
Low CoO
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